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Basics of Packaging
What is a package?
Integrated circuits make he many different functions of semiconductor devices possible. Because silicon chips are very delicate, even a tiny speck of dust or drop of water can hinder their function. Light can also cause malfunctions. To combat these problems, silicon chips are protected by packaging.
Today, high value-added packaging technologies such as SiP (System in a Package) are available. The role of SiP goes beyond "protecting" and is now a mandatory technology for high function products and a critical factor in customer purchasing decisions.
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Package Functions
| Packages perform the following functions: |
| 1. Shut out environmental influences |
 Moisture and dust in the air are direct causes of semiconductor device defects, in addition to vibration and shock. Lighting and magnets can also cause malfunctions. Packages shut out these external influences and serve to protect silicon chips. |
| 2. Enable electrical connectivity |
 If silicon chips are simply wrapped in the package material to protect them from the external environment, they will be unable to exchange signals with the outside. Attaching metal "legs" consisting of lead frame (soldered balls in the case of BGA) allows signals to be sent to semiconductor devices to and from the outside. |
| 3. Dissipate heat |
 Silicon chips heat up during operation. If the temperature of the actual chip becomes too high, the chip will malfunction. Packages can effectively release this heat. And in the case of semiconductor devices that give off especially high levels of heat, such as the CPUs mounted in a PC, heat sinks or cooling fans can further dissipate the heat. |
| 4. Improve handling & assembly |
 Because the circuits built into silicon chips and the silicon chips themselves are so small and delicate, they cannot easily be handled and assembly at such a small scale would be difficult. Placing the chip in a package makes them easier to handle and to assemble on printed circuit boards. |
