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Japan
SMAFTI® Technology
Proprietary attachment process with 50µm bump pitch and 100 Gbps data transmission
The introduction of a silicon-to-silicon attachment process has enabled chip-to-chip connection with a 50µm bump pitch, which is about 1/4th of the conventional pitch size for connection to printed wiring boards. Consequently, the number of pins interconnecting logic and memory chips can be increased, enabling high-speed data transmission of 100 Gbps, which is over 10 times faster than conventional transmission rates.
It is also possible to supply power to the chip stably via 5 µm thick copper wiring. FTI interlayer resin and mold resin work to relax stress, absorbing differences in thermal expansion between the silicon chip and motherboard, and improving the packaging reliability. These features enable smarter connections between multiple ICs and the motherboard.
Number of signal connections between memory and logic chips (bus width)
SMAFTI is a registered trade mark in Japan, Germany, Korea, and Taiwan.