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Japan
SMAFTI® Solutions
High-capacity stacked memory using TSV can also be converted to SiP
This technology also supports stacked memory using through-silicon via (TSV) as the integrated memory. NEC Electronics has developed stacked memory package technology jointly with Elpida and OKI Semiconductor. This technology mounts eight memory chips and one controller chip on a single package.
The three companies have jointly developed (1) a through via technology capable of passing over 1,000 electrode pins through the chip surface using poly-Si TSVs with 50 µm pitch in the memory chip; and (2) stacked assembly technology to join eight 50 µm thick memory chips vertically via micro-bump, and assemble these eight memory chips plus one system LSI integrated circuit chip on a single package.
Using these technologies makes it possible to mount high memory capacity equivalent to a server on a single package, facilitating the implementation of such features as high-definition video processing on mobile devices, and high-speed 3D graphics processing for game devices and the like.
SMAFTI also supports Stacked Memory that use TSVs.
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