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Products > Packages > Trends in package development > SMAFTI >

SMAFTI® Solutions


Proprietary ultra-thin feed-through interposer enabling SiP connection with high-capacity memory


NEC Electronics' proprietary interposer (called a feed-through interposer, or FTI) of only 15µm thickness is based on superconnect technology which uses 15µm wide copper wiring and a 7µm thick polyimide resin which is 1/2 the size of conventional in-package wiring.

NEC's FTI enables a narrow 50µm bump pitch interconnection between memory and logic chips, and extends the wiring from the logic chip to an external pin.
The interposer also supports combined use with Stacked Memory that uses Through Silicone Vias (TSVs) and it can incorporate 8 memory chips and a logic chip within a single package.



SMAFTI also supports Stacked Memory that use TSVs.


Package structure of Stacked Memory

Chip bonding


Memory-TEG chips bonded on FTI wafer
Memory-TEG chips bonded on FTI wafer. 8 chips are stacked as a block.


8-stratum chip stack
Cross-sectional SEM images of SMAFTI package with poly-Si TSVs and Sn-Ag microbumps.




SMAFTI is a registered trade mark in Japan, Germany, Korea, and Taiwan.