CSP (Chip Size Package)

The Chip Size Package (CSP) is a general term for a cutting-edge semiconductor package that aims to be the same size as the chip (bare chip) itself. The detailed definition differs depending on each semiconductor manufacturer.

In reality, the CSP is provided by the BGA (Ball Grid Array) or LGA (Land Grid Array) package, in which electrodes are directly installed on the package bottom, thus making it slightly larger than the chip size. Compared to other packages, however, this package type can be used to make ultra small and ultra thin semiconductors, and thus has been mainly used for electronic devices requiring a smaller implementation area on the board.