SiP (System in a Package)

The various functions provided by electronics devices are generally realized in a three-part system consisting of logic (to process information), memory (to save information), and I/O (to exchange information with the outside). When a device such as a mobile phone needs to be downsized, the challenge is how to build this system with higher density.
As a solution, semiconductor manufacturers are offering SiP (System in a Package) devices in addition to the conventional SoC (System on a Chip) technology.

SoC technology allows a system to be built on one silicon chip (bare chip). This has the disadvantages of taking a long time to develop and being difficult to change once it is completed. In order to keep the cost down, you have to mass produce the chips - maybe produce many more chips than you can use. On the other hand, SiP is a package technology that combines multiple ready-made chips (such as logic and memory) and encases them in 1 package as a single system.

In recent years, the life cycle of electronic devices has shrunk tremendously. This is especially true in the case of mobile phones, where it is said a new model appears every three months. Under these circumstances, the semiconductors in demand are those that can be developed in a short period of time, pay for themselves even in a low product volume, and adapt flexibly to changes in function. An SiP in which a multiple number of chips can be freely combined does indeed meet these requirements. By taking this SiP approach, NEC Electronics is responding to the demand for smaller semiconductors.