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2. Details

2.4 Appendix (packing specifications)

2.4.2 Packing specifications

h)Product without dry pack (for tape packaged products)

Process Emboss tape Individual packing box

Figure2-15 Product without dry pack (for tape packaged products)

Magazine a)Product without dry pack b)Simple dry pack product c)Complete dry pack product Tray NEC Tray d)Simple dry pack product e)Complete dry pack product JEDEC Tray f)Simple dry pack product g)Complete dry pack product Tape h)Product without dry pack i)Simple dry pack product j)Complete dry pack product

(Reference)Storage order for tray products

AdvancedParametric

Packages

• Basics of Packaging
  • Package Variations (IC)
  • Package Variations (Discrete)
• Trends in package development
  • SMAFTI
  • SiP
  • FCBGA
  • CSP
• List of IC packages
  • P-BGA
  • P-FBGA
  • LGA
  • P-QFP
  • P-QFP (FP)
  • P-QFN
  • P-SOP
  • P-SSOP
  • P-TSOP (1)
  • P-TSOP (2)
  • P-SOJ
  • P-DIP, P-SDIP
  • P-SIP
  • P-ZIP
  • P-VDIP
  • P-PGA
• List of Discrete packages
• Outline drawing information
  • System of outline drawing codes for
    IC packages
  • BGA outline drawing codes
  • QFP outline drawing codes
  • SOP outline drawing codes
  • DIP outline drawing codes
  • Reference symbols and dimension examples for BGA
  • Reference symbols and dimension examples for QFP
  • Reference symbols and dimension examples for SOP
  • Reference symbols and dimension examples for DIP
  • Parallelism y1
  • Terminal coplanarity y
  • Tolerance of terminal center position x
  • Tolerance of the center position of package w
• Thermal and electrical characteristics
  • Mechanism of heat dissipation
  • Four major influential factors in thermal
    resistance
  • Thermal design of a package
  • Thermal characteristics
  • Classification of electrical noise
  • Different electrical requirements for different applications
  • Package electrical characteristics
  • Electrical characteristics
• Packing of IC packages
  • Outline
  • Details
  • Details
    • Dry pack packing
    • Guarding against static electricity
    • Cautions for handling
    • Appendix (packing specifications)
    • Appendix (packing specifications)
      • a) Product without dry pack (for magazine packed products)
      • b) Simple dry pack product (for magazine packed products)
      • c) Complete dry pack product (for magazine packed products)
      • d) Simple dry pack
        product (for NEC
        custom tray
        packed products)
      • e) Complete dry pack product (for NEC custom tray packed products)
      • f) Simple dry pack product (for JEDEC tray packed products)
      • g) Complete dry pack product (for JEDEC tray packed products)
      • h) Product without dry pack (for tape packaged products)
      • i) Simple dry pack product (for tape-packaged products)
      • j) Complete dry pack product (for tape-packaged products)
      • (Reference) Storage order for tray products
• Semiconductor Device Mount Manual
  • SOLDERING GENERAL
  • PRINTED WIRING BOARD DESIGN
  • SOLDERING CONDITIONS
  • NOTES ON MOUNTING
  • SOLDER JOINT RELIABILITY
  • APPENDIX
• Links to relevant sites