| Items |
Actual notation |
Possible Values/Descriptions |
| (1) Number of terminals |
2- to 3-digit number |
·Number of terminals in a package |
| (2)Material |
Plastic |
·Package body: mold resin
·Substrate: Organic substrate |
| Tape |
·Substrate: Tape |
| Ceramic |
·Substrate: Ceramic |
(3) Package form[1]
(optional) |
L |
·Low profile
Package seated height:
1.20mm L 1.70mm |
| T |
·Thin
Package seated height:
1.00mmL1.20mm |
| V |
·Very thin
Package seated height:
0.80mmL1.00mm |
| W |
·Very-very thin |
| S |
·Shrink
Reduce basic terminal pitch |
| F |
·Fine pitch
BGAs with terminal pitch of 0.80mm or less |
| (4) Package form[2] |
BGA |
·Ball Grid Array |
| LGA |
·Land Grid Array |
| QFP |
·Quad Flat Package |
| QFN |
·Quad Flat Non-leaded Package |
| SOP |
·Small Outline Package |
| PGA |
·Pin Grid Array |
| DIP |
·Dual Inline Package |
| SIP |
·Single Inline Package |
| ZIP |
·Zigzag Inline Package |
(5) Supplemental items
(optional) |
(Fine pitch) |
·QFP fine pitch package
·QFPs with terminal pitch of 0.50mm or less |
| (Straight) |
·QFP terminal flat package |
| (Cavity down type) |
·BGA cavity down type |
| (Cavity down advanced type) |
·BGA cavity down advanced type |
| (Flip chip type) |
·BGA flip chip type |
| (6)Nominal dimensions |
|
·Package size(width x length)
Example:10 x 10 mm
BGA, LGA, QFP, QFN
·Mount pad in-line interval
Example: 10.16 mm (=400mil)
SOP, SSOP, TSSOP
·The maximum outside of package width x overall length
Example:6x16
TSOP(1)
·Package width
Example:7.62mm(=300 mil)
TSOP(2)
·Terminal in-line interval
Example:7.62 mm (300 mil)
DIP, SDIP
·Package seated height
Example:8.89mm　(350 mil)
ZIP
|
19)
