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Outline drawing information

Outline drawing information for IC packages

System of outline drawing codes for IC packages

System of outline drawing codes for IC packages (NEC codes)

BGA (Ball Grid Array) outline drawing codes
QFP (Quad Flat Package) outline drawing codes
SOP (Small Outline Package) outline drawing codes
DIP (Dual Inline Package) outline drawing codes

Reference symbols and dimension examples for IC package outline drawings

Reference symbols and dimension examples for BGA
Reference symbols and dimension examples for QFP
Reference symbols and dimension examples for SOP
Reference symbols and dimension examples for DIP

Examples of geometric tolerance for IC package outline drawings:

Parallelism y1
Terminal coplanarity y
Tolerance of terminal center position x
Tolerance of the center position of package w

Packages

Basics of Packaging
- Package Variations (IC)
- Package Variations (Discrete)
Trends in package development
- SMAFTI
- SiP
- FCBGA
- CSP
List of IC packages
- P-BGA
- P-FBGA
- LGA
- P-QFP
- P-QFP (FP)
- P-QFN
- P-SOP
- P-SSOP
- P-TSOP (1)
- P-TSOP (2)
- P-SOJ
- P-DIP, P-SDIP
- P-SIP
- P-ZIP
- P-VDIP
- P-PGA
List of Discrete packages
Outline drawing information
Thermal and electrical characteristics
Packing of IC packages
- Outline
- Details
Semiconductor Device Mount Manual
Links to relevant sites

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