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Semiconductor Device Mount Manual


This online manual describes mounting and handling methods for semiconductor devices with the aim of enabling you to execute skillful mounting while maintaining the high reliability of the products.


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Contents Overview (Click a chapter number to jump to that chapter)
CHAPTER 1   SOLDERING GENERAL:
Describes the soldering methods, basic processes, and materials used.
   (1.29MB)
CHAPTER 2   PRINTED WIRING BOARD (PWB) DESIGN :
Describes how to calculate the mounting pad dimensions and pin hole diameter.
   (1.00MB)
CHAPTER 3   SOLDERING CONDITIONS :
Describes the heat resistance and solderability of packages and the soldering conditions used at NEC Electronics.
   (0.99MB)
CHAPTER 4   NOTES ON MOUNTING :
Details points to be noted when executing mixed mounting and reflow + flow processing.
   (1.21MB)
CHAPTER 5   SOLDER JOINT RELIABILITY:
Shows the verified solder joint reliability from various experimental results.
   (0.81MB)
CHAPTER 6   APPENDIX :
Describes various additional items related to packages.
   (0.38MB)