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TABLE OF CONTENTS

CHAPTER 1 SOLDERING GENERAL

1.1  Soldering Methods

1.1.1  Types of soldering method

1.1.2  Features of each soldering method

(1)  Soldering with soldering iron	(2)  Hot air soldering
(3)  Infrared reflow soldering	(4)  Convection reflow soldering	(5)  Convection-infrared reflow soldering
(6)  VPS	(7)  Flow soldering

1.1.3  Adaptation by package types

1.2   Soldering Process Flow

1.2.1  Single-sided soldering

(1) Flow soldering of THD

(2) Flow soldering of SMD

(3) Reflow soldering

1.2.2  Double-sided soldering

(1) Reflow + flow

(2) Reflow + reflow

(3) Flow soldering

1.3   Rework

(1) Removing package	(2) Removing solder
(3) Supplying solder paste	(4) Remounting package
(5) Visual check	(6) Solder joint reliability after rework

1.4   Visual Check

1.4.1  Visual check of lead-type SMD

1.4.2  Visual check of ball-type SMD

1.5   Materials for Mounting

1.5.1  Printed wiring board (PWB)

1.5.2  Flux

1.5.3  Solder paste

1.5.4  Adhesive

1.5.5  Cleaning

CHAPTER 2 PRINTED WIRING BOARD (PWB) DESIGN

2.1   Lead-type SMDs

2.1.1  Tolerance of package dimensions

2.1.2  Pin existence range calculation

2.1.3  Relationship of mount pad size and tolerance

2.1.4  Example of mount pad dimension classified by package

(1)  SOP	(2)  SSOP	(3)  TSSOP
(4)  TSOP(1)(L)	(5)  TSOP(1)(Lp)	(6)  TSOP(2)(L)
(7)  TSOP(2)(Lp)	(8)  QFP
(9)  QFP(fine-pitch),TQFP,LQFP(L)
(10)  QFP(fine-pitch),TQFP,LQFP(Lp)		(11)  SOJ

2.2   Ball-type SMDs

2.2.1  Land structure and land diameter

2.2.2  Example of mount pad dimension

2.3   THDs

2.3.1  Tolerance of package dimensions

2.3.2  Pin existence range calculation

2.3.3  Diameter of DIP through hole

2.3.4  Diameter of SDIP through hole

CHAPTER 3 SOLDERING CONDITIONS

3.1   Solderability

3.1.1  Plating composition

3.1.2  Solderability evaluation method

3.1.3  Plating thickness

3.1.4  Solderability following high-temperature storage

3.1.5  Solderability following long-term storage

(1) Lead material: Fe-Ni

(2) Lead material: Cu

3.2   Heat Resistance

3.2.1  Mechanism of package crack

3.2.2  Package moisture absorption

(1) Absorption control standard settings

(2) Moisture absorption characteristics

(3) Moisture remove characteristics

3.2.3  Causes of package crack occurrence

(a) Moisture absorption of package before soldering

(b) Package structure effect

3.2.4  Countermeasure of package crack

3.3   Recommended Soldering Conditions

3.3.1  Concept of recommended soldering conditions

3.3.2  Recommended condition determination method

3.3.3  Recommended temperature profile for each soldering method

(1) Infrared reflow at 220°C	(2) Infrared reflow at 230°C
(3) Infrared reflow at 235°C	(4) Infrared reflow at 250°C
(5) Infrared reflow at 260°C	(6) VPS (Vapor Phase Soldering)
(7) WS (Wave Soldering)	(8) Partial heating

3.3.4  Description method

3.3.5  Symbol definitions

CHAPTER 4 NOTES ON MOUNTING

4.1  Temperature Distribution Due to Mixed Mounting

4.1.1  Influence of adjacent package size

4.1.2  Distance to adjacent package

4.2  Reflow + Flow Soldering

4.3  BGA Bonding Process

4.3.1  Case 1. Insufficient heat application

4.3.2  Case 2. Unmelted solder

4.3.3  Case 3. Solder joint detachment (ball falloff)

4.3.4  Case 4. Cold solder joint

4.3.5  Case 5. Solder bridge

CHAPTER 5 SOLDER JOINT RELIABILITY

5.1  Influence of Soldering Temperature

5.1.1  Ball-type SMD

5.1.2  Lead-type SMD

5.2  Influence of Printed Wiring Board Thickness

5.3  Influence of Pad Structure of Printed Wiring Board

5.4  Single-sided Soldering and Double-sided Soldering

5.5  Combinations of Device Plating and Solder Material

5.6  Migration

CHAPTER 6 APPENDIX

6.1  Characteristics of Constituent Materials

6.1.1  Thermal expansion coefficients of constituent materials

6.2  Package Samples

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