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Products > Packages > Semiconductor Device Mount Manual > SOLDER JOINT RELIABILITY >

CHAPTER 5 SOLDER JOINT RELIABILITY

5.1 Influence of Soldering Temperature

5.1.1 Ball-type SMD

The results of mounting a lead-free BGA product using Sn-3Ag-0.5Cu solder (melting point: 217°C to 220°C) and Sn-Pb eutectic solder (melting point: 183°C) under various temperatures, visually checking the solder joint, and performing temperature cycle testing, are shown below.
If the BGA balls used for mounting are Sn-3Ag-0.5Cu and the solder paste is Sn-Pb eutectic solder, the solder paste will not completely fuse beneath the solder ball melting point.
Moreover, during temperature cycle testing after mounting, if the soldering temperature was low, the result will be that the temperature cycle life is short. Therefore, to obtain sufficient solder joint reliability, it is necessary to set the temperature to the solder ball or solder paste melting point (whichever is higher) +, taking into consideration temperature variations during the mounting process.