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CHAPTER 4 NOTES ON MOUNTING
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Solder bridges occur when the amount of solder paste print is inadequate due to warping of the device or printed circuit board, etc. Figure 4-14 shows an example of a solder bridge observed via X-ray. In this example, the device warped convexly during reflow heat application, which caused the solder balls on the outer edge to be squashed down and touch the neighboring balls, forming a bridge. These balls did not separate even when the device returned to normal after cooling, leaving a solder bridge. |
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Figure 4-14. Example of Solder Bridge
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Figure 4-15. Mechanism for Inferring Cause of Solder Bridge
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The following measures can be implemented to prevent the problem of solder bridges.
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