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CHAPTER 4 NOTES ON MOUNTING

4.1 Temperature Distribution Due to Mixed Mounting

The following describes how the solder joint temperature of a device is influenced by the adjacent device size or mounting pitch (distance) taking a certain device as an example. 4.1.1 Influence of adjacent package size 4.1.2 Distance to adjacent package

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  • SOLDERING GENERAL
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  • SOLDERING CONDITIONS
  • NOTES ON MOUNTING
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  • APPENDIX
  • NOTES ON MOUNTING
    • Temperature
      Distribution Due to
      Mixed Mounting
    • Reflow + Flow Soldering
    • BGA Bonding Process
    • Temperature
      Distribution Due to
      Mixed Mounting
      • Influence of adjacent package size
      • Distance to adjacent package
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