CHAPTER 4 MOUNTING METHODS(11.2KB)

4.1 THD(733B) To 4.1.2 Basic mounting conditions(1.37KB)To 4.1.4 Notes(1.37KB)

4.1.1 Printed wiring board design 4.1.2 Basic mounting conditions
4.1.3 Rework 4.1.4 Notes

4.1.3 Rework

(1) Method

THD rework is performed by simple plate-style flow (jet flow) soldering equipment. Flow (jet flow) solder is applied only to the solder joint of the board and the part to be reworked, and then the THD is removed.

Spot Reflow(20.391KB)
Figure 4-5. Spot Reflow



(2) Soldering methods and conditions

1) The reworked part must be removed after the lead clinch (bent lead) is repaired.
2) Do not exceed the thermal resistance temperature of the parts mounted around those to be reworked.

To 4.1.2 Basic mounting conditions (1.37KB)To 4.1.4 Notes (1.37KB)
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