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Products > Packages > Semiconductor Device Mount Manual > NOTES ON MOUNTING > Temperature Distribution Due to Mixed Mounting >

CHAPTER 4 NOTES ON MOUNTING


4.1 Temperature Distribution Due to Mixed Mounting
4.1.1 Influence of adjacent package size

As the adjacent device size increases, the temperature difference between devices also increases (see Figure 4-2).
Therefore, temperature profile settings should be made with due caution.

Temperature measurement package:
   35 x 35mm BGA		 Adjacent packages:
 <1> 19 x 19mm
 <2> 27 x 27mm
 <3> 35 x 35mm
 <4> 40 x 40mm
 <5> 45 x 45mm

  
Reflow conditions: 232°C to 233°C
     (peak temperature of BGA ball part)
Reflow oven: Air type
Conveyor speed: 0.9 m/minute
Printed wiring board:
  Number of layers: 4; Material: FR-4;
  Board thickness: 1.6 mm
Temperature measurement locations
  A: Ball part near adjacent package
  B: Ball part far from adjacent package
Figure 4-1. Temperature measurement conditions

Figure 4-2. Influence of Adjacent Package Size (Relationship with Thermal Capacitance)
To 4.1 Temperature Distribution Due to Mixed MountingTo 4.1.2 Distance to adjacent package