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CHAPTER 3 SOLDERING CONDITIONS



In order to preserve the reliability of the device when soldering, it is necessary to set soldering conditions that take into account the moisture absorption and heat resistance characteristics of the package, and the wettability of the terminal.

Plastic packages absorb moisture, and when subjected to heat stress, the device reliability may degrade. Recommended soldering conditions have therefore been set to give our customers confidence when using NEC Electronics products.

Packages are also packed in dry packing to prevent moisture absorption before use.

This chapter explains the recommended soldering conditions for respective devices.

3.1 Solderability
 
3.2 Heat Resistance
 
3.3 Recommended Soldering conditions


To 2.3.4 Diameter of SDIP through holeTo 3.1 Solderability