|
[Soldering method]
The soldering method is indicated by a code consisting of two letters of the alphabet, as shown in the
table on the right. |
|
Table 3-12.
Soldering Method
| Symbol
|
Soldering
Method |
| IR |
Infrared
reflow |
| VP |
VPS
|
| WS |
Wave
soldering |
|
|
[Peak temperature]
The peak temperature is indicated by the lower two digits of the specified peak temperature. Note that
the package surface temperature is indicated if the recommended soldering method is infrared reflow
or VPS, and that the molten solder temperature is indicated if the soldering method is wave soldering. |
|
Table 3-13.
Peak Temperature
| Symbol
|
Peak
Temperature |
| 15 |
215°C
|
| 20 |
220°C
|
| 30 |
230°C
|
| 35 |
235°C
|
| 60 |
260°C
|
|
|
[Baking time]
The recommended baking time is indicated by using the symbols, each consisting of two numerical digits,
shown in the table on the right. |
|
Table 3-14.
Baking Time
| Symbol
|
Baking
Time
(When Stored at 125°C) |
| 00 |
Baking
unnecessary
(0 hours) |
| 10 |
10
hours MIN.,
72 hours MAX. |
| 16 |
16
hours MIN.,
72 hours MAX. |
| 20 |
20
hours MIN.,
72 hours MAX. |
| 36 |
36
hours MIN.,
72 hours MAX. |
|
|
[Number of storage
days after opening dry pack]
The number of days during which the product can be stored after the dry pack has been opened is indicated
by the symbols shown on the right. |
|
Table 3-15.
Number of Storage Days After Opening Dry Pack
| Symbol
|
Number
of days
(25°C, 65% RH or less) |
| 1 |
1 day
(24 hours) MAX. |
| 2 |
2 days
(48 hours) MAX. |
| 3 |
3 days
(72 hours) MAX. |
| 7 |
7 days
(168 hours) MAX. |
| None
|
Not
limited |
|
|
[Number of times
of mounting]
The number of times the product can be mounted is indicated by the symbols shown on the right. |
|
Table 3-16.
Number of Times of Mounting
| Symbol
|
Number
of Times |
| 1 |
1 |
| 2 |
2 times
MAX. |
| 3 |
3 times
MAX. |
|
|
The above symbol codes apply to the
products that can be soldered by means of a total heating method. Some of NEC Electronic's SMDs, however, cannot
be soldered by a total heating method, and a code indicating that these products must be soldered by
a partial heating method is used for such products. |
|
