| (6) Recommended
temperature profile for partial heating |
|
The recommended soldering conditions
for the partial heating method are shown below. |
|
a) Products inserted in
the board |
Table 3-10.
Recommended Conditions
| ·
Peak temperature |
300°C
or below (temperature of pins) |
| ·
Time |
3
seconds or less (per one pin) |
| ·
Flux |
Rosin
flux with minimal chlorine content (chlorine(percentage mass) : 0.2 % or less)
|
|
b) Products mounted on the
board |
Table 3-11.
Recommended Conditions
| ·
Peak temperature |
300°C
or below (temperature of pins) |
| ·
Time |
3
seconds or less (per one side) |
| ·
Flux |
Rosin
flux with minimal chlorine content (chlorine(percentage mass): 0.2 % or less)
|
|
