| (3) Recommended
temperature profile for infrared reflow at 235°C |
|
The recommended soldering conditions
for the infrared reflow method are shown below. |
Table 3-7. Recommended
Conditions
·
Maximum reflow temperature
(package surface temperature) |
235°C
or below |
| ·
Time at maximum temperature |
10 seconds
or less |
| ·
Time at 210°C or above |
30 seconds
or less |
| ·
Time with preheat temperature of 100 to 160°C |
60 to
120 seconds |
·
Amount of chlorine in rosin base flux
(percentage mass) |
0.2 %
or less |
 |
| Figure 3-27 Temperature
Profile of Infrared Reflow |
| * The number of reflow times is
one, two or three, depending on the product. For details, consult an NEC Electronics sales representative. |
|
