| (1) Recommended
temperature profile for infrared reflow at 220°C |
|
The recommended soldering conditions
for the infrared reflow method are shown below. |
Table 3-5. Recommended
Conditions
·
Maximum reflow temperature
(package surface temperature) |
220°C
or less |
| ·
Time with reflow temperature of 183°C |
60 seconds
or less |
| ·
Time with preheat temperature of 120 to 160°C |
60 to
90 seconds |
·
Amount of chlorine in rosin base flux
(percentage mass) |
0.2 %
or less |
 |
| Figure 3-5. Temperature
Profile of Infrared Reflow |
| * The number of reflow times is
one, two or three, depending on the product. For details, consult an NEC Electronics sales representative. |
|
