CHAPTER 3 SOLDERING CONDITIONS(9.78KB)

3.4 Soldering Conditions(1.89KB) To 3.4.2 Setting method(1.35KB)To 3.4.4 Description method(1.36KB)

3.4.1 NEC Electronic's concept of recommended
soldering conditions
3.4.2 Setting method 3.4.3 Classifications
3.4.4 Description method 3.4.5 Symbol definitions    

3.4.3 Classifications

NEC Electronic's recommended soldering conditions can be broadly classified into heating conditions of soldering method, package moisture absorption control, and number of times the product is to be mounted. NEC Electronic's basic classification of soldering methods and the recommended soldering conditions are shown below.

(1) Recommended temperature profile for infrared reflow at 220°C
(2) Recommended temperature profile for infrared reflow at 230°C
(3) Recommended temperature profile for infrared reflow at 235°C
(4) Recommended temperature profile for VPS
(5) Recommended temperature profile for WS
(6) Recommended temperature profile for partial heating

Notes 1. The recommended peak temperature for infrared reflow soldering is 220°C, 230°C or 235°C depending on the product. For details, consult an NEC Electronics sales representative.
2. The number of times the product can be mounted is either once, twice or three times depending on the product. For details, consult an NEC Electronics sales representative.
3. For details on the partial heating method, refer to the section on soldering methods.
When mounting a device using soldering iron or flow soldering, be sure to earth the soldering equipment via a 1 M ohm resistor to prevent power leakage.

To 3.4.2 Setting method(1.35KB)To 3.4.4 Description method(1.36KB)

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