CHAPTER 3 SOLDERING CONDITIONS(9.78KB)

3.4 Soldering Conditions(1.89KB) To 3.3.3 Resealing a complete dry pack(2/2 Page)(1.35KB)To 3.4.2 Setting method(1.36KB)

3.4.1 NEC Electronic's concept of recommended
soldering conditions		 3.4.2 Setting method 3.4.3 Classifications
3.4.4 Description method 3.4.5 Symbol definitions    

3.4.1 NEC Electronic's concept of recommended soldering conditions

NEC Electronics specifies the recommended soldering conditions for individual products, rather than for a particular product group (such as memories or microcomputer), or package group (such as SOP or QFP). This is because the reliability of the product is heavily influenced by the following factors, as described in the preceding section:

1. Moisture absorption of package (storage conditions)
2. Soldering conditions (method and conditions)
3. Package structure (thickness, chip size, etc.)
For details of the mounting conditions for individual products, please contact an NEC Electronics sales representative.

To 3.3.3 Resealing a complete dry pack(2/2 Page)(1.35KB)To 3.4.2 Setting method(1.36KB)
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