CHAPTER 3 SOLDERING CONDITIONS
3.3 Recommended Soldering Conditions
3.3.5 Symbol definitions
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[Soldering method]
The soldering method is indicated by a code consisting of two letters of the alphabet, as shown in the table on the right. |
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Table 3-3-10. Soldering Method
| Symbol |
Soldering Method |
| IR |
Infrared reflow |
| VP |
VPS |
| WS |
Wave soldering |
|
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[Maximum temperature]
The peak temperature is indicated by the lower two digits of the specified peak temperature. Note that the package surface temperature is indicated if the recommended soldering method is infrared reflow or VPS, and that the molten solder temperature is indicated if the soldering method is wave soldering. |
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Table 3-3-11. Maximum Temperature
| Symbol |
Maximum Temperature |
| 20 |
220°C |
| 30 |
230°C |
| 35 |
235°C |
| 50 |
250°C |
| 60 |
260°C |
|
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[Baking time]
The recommended baking time is indicated by using two numerical digits, shown in the table on the right. |
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Table 3-3-12. Baking Time
| Symbol |
Baking Time
(When Stored at 125°C) |
| 00 |
Baking unnecessary
(0 hours) |
| 10 |
10 hours MIN.,
72 hours MAX. |
| 20 |
20 hours MIN.,
72 hours MAX. |
| 36 |
36 hours MIN.,
72 hours MAX. |
|
|
[Number of storage days after opening dry pack]
The number of days during which the product can be stored after the dry pack has been opened is indicated by the symbols shown on the right. |
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Table 3-3-13. Number of Storage Days After Opening Dry Pack
| Symbol |
Number of days
(at 5 to 25°C, 20 to 65%RH) |
| 1 |
1 day (24 hours) MAX. |
| 2 |
2 days (48 hours) MAX. |
| 3 |
3 days (72 hours) MAX. |
| 7 |
7 days (168 hours) MAX. |
| None |
Not limited |
|
|
[Number of times of mounting]
The number of times the product can be mounted is indicated by the symbols shown on the right. |
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Table 3-3-14. Number of Times of Mounting
| Symbol |
Number of Times |
| 1 |
1 |
| 2 |
2 times MAX. |
| 3 |
3 times MAX. |
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Remark |
The above symbol codes apply to the products that can be soldered by means of a total heating method. Some of NEC Electronic's SMDs, however, cannot be soldered by a total heating method, and a code "partial heating" indicating that these products must be soldered by a partial heating method is used for such products. |
