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Products > Packages > Semiconductor Device Mount Manual > SOLDERING CONDITIONS > Recommended Soldering Conditions >

CHAPTER 3 SOLDERING CONDITIONS


3.3 Recommended Soldering Conditions
3.3.4 Description method

The description of the recommended soldering conditions for NEC Electronics products consists of following five codes.

  • Soldering method
  • Maximum temperature
  • Baking time
  • Number of storage days after the dry pack has been opened
  • Number of times the product can be mounted

These symbol codes are used in combination as shown in the example in Figure 3-3-10 below.

Example of Recommended Soldering Condition Symbols 1(4.62KB)
Example of Recommended Soldering Condition Symbols 1(9.49KB)

Figure 3-3-10. Example of Recommended Soldering Condition Symbols
To 3.3.3(8) Partial heating</B>To 3.3.5 Symbol definitions