CHAPTER 3 SOLDERING CONDITIONS
3.3 Recommended Soldering Conditions
3.3.3 Recommended temperature profile for each soldering method
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The following is recommended soldering conditions of partial heating. |
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a) Products inserted in the board |
Table 3-3-8. Recommended Conditions
| · Maximum temperature |
300°C or below (temperature of pins) |
| · Time |
3 s or less (per one pin) |
| · Flux |
Rosin flux with minimal chlorine content (chlorine(percentage mass) : 0.2 % or less)
|
| * |
The peak temperature is 300 or 350°C, depending on the product.
For details, consult an NEC Electronics sales representative. |
|
b) Products mounted on the board |
Table 3-3-9. Recommended Conditions
| · Maximum temperature |
300°C or below (temperature of pins) |
| · Time |
3 s or less (per one side) |
| · Flux |
Rosin flux with minimal chlorine content (chlorine(percentage mass): 0.2 % or less)
|
| * |
The peak temperature is 300 or 350°C, depending on the product.
For details, consult an NEC Electronics sales representative. |
