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CHAPTER 3 SOLDERING CONDITIONS
3.3 Recommended Soldering Conditions
3.3.3 Recommended temperature profile for each soldering method
| (3) Infrared reflow at 235°C |
| The following is recommended soldering conditions of infrared reflow. |
| · Maximum temperature (package's surface temperature) |
235°C or below |
| · Time at maximum temperature | 10 s or less |
| · Time of temperature higher than 210°C | 30 s or less |
| · Preheating time at 100 to 160°C | 60 to 120 s |
| · Maximum chlorine content of rosin flux (percentage mass) |
0.2 % or less |
 |
| Figure 3-3-4. Infrared Reflow Temperature Profile |
| * | The number of reflow times is one, two or three, depending on the product. For details, consult an NEC Electronics sales representative. |
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