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CHAPTER 3 SOLDERING CONDITIONS
3.3 Recommended Soldering Conditions
3.3.3 Recommended temperature profile for each soldering method
| (1) Infrared reflow at 220°C |
| The following is recommended soldering conditions of infrared reflow. |
| · Maximum temperature (package's surface temperature) |
220°C or below |
| · Time of temperature higher than 183°C | 60 s or less |
| · Preheating time at 120 to 160°C | 60 to 90 s |
| · Maximum chlorine content of rosin flux (percentage mass) |
0.2 % or less |
 |
| Figure 3-3-2. Infrared Reflow Temperature Profile |
| * | The number of reflow times is one, two or three, depending on the product. For details, consult an NEC Electronics sales representative. |
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