Please note that JavaScript and style sheet are used in this website,
Due to unadaptability of the style sheet with the browser used in your computer, pages may not look as original.
Even in such a case, however, the contents can be used safely.
CHAPTER 3 SOLDERING CONDITIONS
3.3 Recommended Soldering Conditions
3.3.3 Recommended temperature profile for each soldering method
| NEC Electronic's recommended soldering conditions can be broadly classified into heating conditions of soldering method, package moisture absorption control, and number of times the product is to be mounted.
NEC Electronic's basic classification of soldering methods and the recommended soldering conditions are shown below. |
| Notes1. | The recommended peak temperature for infrared reflow soldering is 220°C, 230°C, 235°C, 250°C, or 260°C depending on the product. For details, consult an NEC Electronics sales representative. | ||||||||||||||
| Notes2. | The number of times the product can be mounted is either once, twice or three times depending on the product. For details, consult an NEC Electronics sales representative. | ||||||||||||||
| Notes3. | For details on the partial heating method, refer to the section on soldering methods. When mounting a device using soldering iron or flow soldering, be sure to earth the soldering equipment via a 1 M ohm resistor to prevent power leakage. |
||||||||||||||
  |
© 1995-2008 NEC Electronics Corporation
