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Products > Packages > Semiconductor Device Mount Manual > SOLDERING CONDITIONS >

CHAPTER 3 SOLDERING CONDITIONS


3.3 Recommended Soldering Conditions
3.3.1 Concept of recommended soldering conditions

NEC Electronics specifies the recommended soldering conditions for individual products, rather than for a particular product group (such as memories or microcomputer), or package group (such as SOP or QFP).

This is because the reliability of the product is heavily influenced by the following factors, as described in the preceding section:

  • Moisture absorption of package (storage conditions)
     
  • Soldering conditions (method and conditions)
     
  • Package structure (thickness, chip size, etc.)

For details of the soldering conditions for individual products, please contact an NEC Electronics sales representative.


To 3.2.4 Countermeasure of package crackTo 3.3.2 Recommended condition determination method