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Products > Packages > Semiconductor Device Mount Manual > SOLDERING CONDITIONS > Heat Resistance >

CHAPTER 3 SOLDERING CONDITIONS


3.2 Heat Resistance
3.2.4 Countermeasure of package crack

3.2.3 shows the relationship among the above causes of package crack and degradation of reliability.

The following countermeasures should be taken to prevent occurrence of package crack and reliability degradation and to expand the safety region.

< Points >
1. Control must be made so that the moisture absorption rate of the package is lowered.
2. Select a soldering method with a low thermal stress.
3. Whenever possible, select a thick package.

To 3.2.3(b) Package structure effect3.3 Recommended Soldering Conditions