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Products > Packages > Semiconductor Device Mount Manual > SOLDERING CONDITIONS > Heat Resistance >

CHAPTER 3 SOLDERING CONDITIONS


3.2 Heat Resistance
3.2.3 Causes of Package Crack Occurrence

(b) Package structure effect

Figures 3-2-8 and 3-2-9 show the relationship of island size and island back surface moisture concentration at crack occurrence obtained by simulation.s
These figures indicate that the package crack tends to occur as the island size becomes larger.

Figure 3-2-8 and 3-2-9 show following things.

  • The crack tends not to occur as the package becomes thicker.
  • The occurrence of the crack can be suppressed if reflow temperature is lowered even in the case of large island size packages.

パッケージ厚と水分濃度の関係グラフ(5.36KB)

リフローピーク温度と水分濃度の関係グラフ(5.34KB)

Figure 3-2-8. Relation Between Package Thickness and Moisture Concentration

Figure 3-2-9. Relation Between Package Reflow Temperature and Moisture Concentration

To 3.2.3(a) Moisture absorption of package before solderingTo 3.2.4 Countermeasure of package crack