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CHAPTER 3 SOLDERING CONDITIONS
3.2 Heat Resistance
3.2.2 Package Moisture Absorption
| (1) Absorption control standard settings |
| The plastic package is made of epoxy-based mold resin. Because the molecules of this epoxy resin are coarse, the package absorbs a small amount of moisture contained in are if it is stored at room temperature. Figures 3-2-2 and 3-2-3 show examples of the moisture absorption behavior. These figures indicate that a thin type SMD absorbs moisture up to 0.36% when it is stored outdoors, and up to 0.27% when stored indoors (in Tokyo). The maximum moisture absorption when the sample is stored outdoors is equivalent to a saturated absorption rate at about 30°C, 75%RH, and that when the sample is stored indoors is equivalent to a saturated absorption rate at about 25°C, 65%RH. The maximum value was observed in summer when the temperature and humidity rise, and the minimum value was recorded in winter when the temperature drops. |
Based on these data, NEC Electronics specifies the moisture processing test conditions as fellows.
(Both conditions are determined by taking into consideration areas where temperature and humidity are high.)
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© 1995-2008 NEC Electronics Corporation
