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CHAPTER 3 SOLDERING CONDITIONS


3.1 Solderability
3.1.5 Solderability following long-term storage

The results of solderability tests performed after storing devices in different storage environments are shown below. These results indicate that under various storage conditions, satisfactory solder wettability, with the zero-cross time remains almost unchanged even after two years.

(1) Lead material: Fe-Ni

Table 3-1-2. Meniscograph Testing Conditions
Flux Rosin - R Type
Sample 100 pin QFP(42 alloy)
Testing temperature 210 ±3°C
Dipping speed 25 mm/s
Dipping depth 1.0 mm
Dipping time 5 s
Dipping lead count 20
Sample count 20
Storage conditions 25 ±5°C, 25 to 80%RH


Solder Wettability Test Results

Figure 3-1-7. Results of Wetting Balance Test
To 3.1.4 Solderability following high-temperature storageTo 3.1.5(2) Lead material: Cu