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CHAPTER 3 SOLDERING CONDITIONS
3.1 Solderability
3.1.5 Solderability following long-term storage
| (2) Lead material: Cu |
| Flux | Rosin - R Type |
| Sample | 208 pin QFP(Cu) |
| Testing temperature | 245°C |
| Dipping speed | 10 mm/s |
| Dipping depth | 1.5 mm |
| Dipping time | 10 s |
| Dipping lead count | 10 |
| Sample count | 10 |
| Storage conditions | 25 ±5°C, 50±30%RH |
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