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CHAPTER 3 SOLDERING CONDITIONS
3.1 Solderability
3.1.4 Solderability following high-temperature storage
| Figure 3-1-6 shows the solderability when high-temperature baking (150°C) is performed for up to 500 hours. These results indicate stable solderability with the wet time remaining unchanged even after 500 hours. |
| Flux | Rosin - R Type |
| Dipping speed | 10 mm/s |
| Dipping depth | 1.5 mm |
| Dipping time | 5 s |
| Dipping lead count | 10 |
| Sample count | 10 |
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