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Products > Packages > Semiconductor Device Mount Manual > SOLDERING CONDITIONS > Solderability >

CHAPTER 3 SOLDERING CONDITIONS


3.1 Solderability
3.1.3 Plating thickness

If the plating film is not flat and the plating is thin, a larger number of pin holes go through all the way to the substrate, degrading the substrate protection function, and corrosion resistance worsens.

Figure 3-1-4 shows the relationship between the semi-gloss solder plating thickness and the number of pin holes.
If the plating thickness is approx. 4 µm or greater, no rusting should occur and there should be no through pin holes.


Plating Thickness and Pin Hole

Figure 3-1-4. Plating Thickness and Pin Hole

Next, mounting evaluation examples of a case in which the lead plating thickness is reduced are introduced.
Satisfactory solderability was obtained even in the case of reduced plating thickness as shown in Figure 3-1-5.
Even if the plating thickness is reduced in areas as a result of contact friction/scraping during the electrical test process following lead plating, the solderability should not suffer.


Plating Thickness and Solderability
Mounting conditions
 • Package: 14 x 14mm, 100 pin LQFP
 • Plating type: Sn-Pb
 • Solder paste: Sn-37Pb
 • Soldering temperature: Max. 214.9°C
Figure 3-1-5. Plating Thickness and Solderability
To 3.1.2 Solderability evaluation methodTo 3.1.4 Solderability following high-temperature storage