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CHAPTER 3 SOLDERING CONDITIONS


3.1 Solderability
3.1.2 Solderability evaluation method

One of the solderability evaluation method is the quantitative measurement method known as the wetting balance method (EIAJ-ET-7401). Figure 3-1-1 shows a meniscograph curve indicating the measurement mechanism.
The shorter the wet time (B to E in Figure 3-1-1), the better the solderability.

Figure 3-1-2 shows the relationship between the solder composition and the wet time. In the Sn-Pb state chart (Figure 3-1-3), the wet time forms a curve that travels between the liquid line and solid line, and it is shortest in the vicinity of the eutectic solder.


Meniscograph Curve

Figure 3-1-1. Meniscograph Curve


Solder Composition and Wet Time
Sn-Pb Conditions


Figure 3-1-2. Solder Composition and Wet Time


Figure 3-1-3. Sn-Pb Conditions


To 3.1.1 Plating compositionTo 3.1.3 Plating thickness