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| One of the solderability evaluation method is the quantitative measurement method known as the wetting balance method (EIAJ-ET-7401). Figure 3-1-1 shows a meniscograph curve indicating the measurement mechanism. The shorter the wet time (B to E in Figure 3-1-1), the better the solderability. Figure 3-1-2 shows the relationship between the solder composition and the wet time. In the Sn-Pb state chart (Figure 3-1-3), the wet time forms a curve that travels between the liquid line and solid line, and it is shortest in the vicinity of the eutectic solder. |
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| Figure 3-1-1. Meniscograph Curve |
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