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CHAPTER 3 SOLDERING CONDITIONS
Depending on their fabrication process history, the surface of external leads of lead type SMD may oxidize, molding residue may appear during mold resin sealing, and impurities may adhere. Such conditions may cause the leads to corrode and thus cause soldering defects during the process of soldering parts onto the printed board, or during the socket mounting process (mechanical joint defects), or poor electric conduction. Therefore, in addition to removing the oxidized film on the surface of external leads and protecting the lead material, it is necessary to implement surface treatment so as to facilitate soldering and socket mounting. NEC Electronics' device lead exterior plating specifications are as follows. |
| 1) Conventional plating • Plating composition: Sn-Pb = (Pb: Approx. 10w%, remainder Sn) • Plating thickness: Approx. 10 µm • Finish: From non-gloss to semi-gloss |
| 2) Lead-free plating • Plating composition: Sn-Bi (Bi: Approx. 2.5w%, remainder Sn) • Plating thickness: Approx. 12 µm • Finish: From non-gloss to semi-gloss |
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