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Products > Packages > Semiconductor Device Mount Manual > PRINTED WIRING BOARD DESIGN > THDs >

CHAPTER 2 PRINTED WIRING BOARD DESIGN


2.3 THDs
2.3.3 Diameter of DIP through hole

The radius of the hole on the printed wiring board, taking the pin thickness direction into consideration, is as follows.

Radius of the hole on the printed wiring board equation(3.28KB)

Therefore, the hole diameter is = 2 x r = 2 x 0.46 = 0.92 mm.
This relationship is shown in Figure 2-17.

Figure 2-17. Relations Between Pin Shifted from Center Position and Hole Diameter

Consequently, if the diameter of the hole in the board is 0.92 mm (MIN.), the pins can be inserted easily.
However, because the tip of the pin in plastic DIPs is tapered (taper ratio: 0.2/0.5), the pin is inserted into a hole 0.8 mm (MIN.) in diameter.
If the hole diameter is too large, the pin may not be completely soldered when performing solder flow mounting. When designing the actual mount pad, it is necessary to comprehensively investigate all the soldering conditions: the desired pin connection strength, the precision of the package/printed board and the mounting equipment, and the performance of the soldering equipment.

To 2.3.2 Pin existence range calculationTo 2.3.4 Diameter of SDIP through hole