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Products > Packages > Semiconductor Device Mount Manual > PRINTED WIRING BOARD DESIGN >

CHAPTER 2 PRINTED WIRING BOARD DESIGN


2.2 Ball-type SMDs

There are a number of ball-type SMDs available, as follows.

  • PBGA .... Plastic BGA
  • ABGA .... Plastic BGA (advanced type)
  • FCBGA .... Plastic BGA (flip-chip type)
  • TBGA .... Tape BGA
  • FPBGA .... Fine-pitch plastic BGA
  • FPLGA .... Fine-pitch plastic LGA
  • TFPBGA .... Tape fine-pitch plastic BGA

It is important to note that because a package's solder ball connection pads are routed differently depending on the ball array (total array, peripheral array, zigzag array) and the material of the printed wiring board, the pad diameter may vary among individual packages even if their ball pitch is the same.

An example of the mount pad dimensions for a BGA or CSP(FPBGA) is shown in 2.2.2.
It is generally believed that in order to evenly distribute the stress at the solder joints following solder-mounting, the package's ball land diameter and the dimensions of the board's mount pads should be identical.



To 2.1.4(11) SOJ mount pad dimensionsTo 2.2.1 Land structure and land diamiter