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Products > Packages > Semiconductor Device Mount Manual > PRINTED WIRING BOARD DESIGN > Ball-type SMDs >

CHAPTER 2 PRINTED WIRING BOARD DESIGN


2.2 Ball-type SMDs
2.2.1 Land structure and land diameter

Land structure of each package is shown in Table 2-13.

Table 2-13. Land structure and land diameter of packages
Package Land structure Pin pitch (mm)
1.5 1.27 1.0 0.8 0.75 0.65 0.5
PBGA SMD 0.63 0.63 0.45 - - - -
ABGA SMD - 0.63 0.5 - - - -
FCBGA SMD - 0.63 0.53 0.4 - - -
TBGA SMD - 0.53 0.42 0.32 - - -
FPBGA SMD - - - 0.4 - 0.35 0.24 to 0.30
FPLGA NSMD - - - 0.45 - 0.35 0.24 to 0.27
TFPBGA SMD - - - 0.4 0.31 - 0.24 to 0.30

Remarks
1. Only representative dimensions are inscribed above. As there are cases where the dimensions differ with packages, please contact to NEC Electronics sales representative for details.
2.
To 2.2 Ball-type SMDsTo 2.2.2 Exrmple of mount pad dimensions