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Products > Packages > Semiconductor Device Mount Manual > PRINTED WIRING BOARD DESIGN > Lead-type SMDs >

CHAPTER 2 PRINTED WIRING BOARD DESIGN


2.1 Lead-type SMDs
2.1.4 Example of mount pad dimension classified by package

(6) TSOP(2) mount pad dimensions
--- ( Length of pin flat section: L specification )


 

 

Figure 2-8. TSOP(2) Mount Pad Dimensions(Length of Soldered Section: L Specification)


Table 2-7. Example of Soldering Parameters (Unit: mm)
1.27 0.80 0.65 0.50 Remark
0.2 Soldering strength
0.2 Mask pattern precision and observability
0.3 to 0.57 0.3 0.3 0.25 Solder bridge tolerance

To 2.1.4(5) TSOP(1) mount pad dimensions (Lp)To 2.1.4(7) TSOP(2) mount pad dimensions (Lp)