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Products > Packages > Semiconductor Device Mount Manual > PRINTED WIRING BOARD DESIGN > Lead-type SMDs >

CHAPTER 2 PRINTED WIRING BOARD DESIGN

2.1 Lead-type SMDs

2.1.4 Example of mount pad dimension classified by package

(11) SOJ mount pad dimensions



Figure 2-13. SOJ Mount Pad Dimensions

Table 2-12. Example of Soldering Parameters( Unit: mm)
	1.27	Remark
l₁	1.20	Setting of recommended value from EIAJ ED-7406 (old specification)
l₂	2.00	Setting of recommended value from EIAJ ED-7406 (old specification)
b₂	0.75	Setting of recommended value from EIAJ ED-7406 (old specification)

Packages

Basics of Packaging
- Package Variations (IC)
- Package Variations (Discrete)
Trends in package development
- SMAFTI
- SiP
- FCBGA
- CSP
List of IC packages
- P-BGA
- P-FBGA
- LGA
- P-QFP
- P-QFP (FP)
- P-QFN
- P-SOP
- P-SSOP
- P-TSOP (1)
- P-TSOP (2)
- P-SOJ
- P-DIP, P-SDIP
- P-SIP
- P-ZIP
- P-VDIP
- P-PGA
List of Discrete packages
Outline drawing information
Thermal and electrical characteristics
Packing of IC packages
- Outline
- Details
Semiconductor Device Mount Manual
- PRINTED WIRING BOARD DESIGN
  - Lead-type SMDs
Links to relevant sites

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