Please note that JavaScript and style sheet are used in this website,
Due to unadaptability of the style sheet with the browser used in your computer, pages may not look as original.
Even in such a case, however, the contents can be used safely.

HOMEAPPLICATIONSPRODUCTSTECHNOLOGYSUPPORTPURCHASENEWS & EVENTSABOUT US

SITE MAP CONTACT US

Products > Packages > Semiconductor Device Mount Manual > PRINTED WIRING BOARD DESIGN > Lead-type SMDs >

CHAPTER 2 PRINTED WIRING BOARD DESIGN

2.1 Lead-type SMDs

2.1.4 Example of mount pad dimension classified by package

(8) QFP mount pad dimensions


Figure 2-10. QFP Mount Pad Dimensions

Table 2-9. Example of Soldering Parameters (Unit: mm)
1.00	0.80	0.65	Remark
0.2			Cleanliness of printed wiring board
0.5			Soldering strength
0.2			Mask pattern precision and observability
0.3			Solder bridge tolerance

Packages

Basics of Packaging
- Package Variations (IC)
- Package Variations (Discrete)
Trends in package development
- SMAFTI
- SiP
- FCBGA
- CSP
List of IC packages
- P-BGA
- P-FBGA
- LGA
- P-QFP
- P-QFP (FP)
- P-QFN
- P-SOP
- P-SSOP
- P-TSOP (1)
- P-TSOP (2)
- P-SOJ
- P-DIP, P-SDIP
- P-SIP
- P-ZIP
- P-VDIP
- P-PGA
List of Discrete packages
Outline drawing information
Thermal and electrical characteristics
Packing of IC packages
- Outline
- Details
Semiconductor Device Mount Manual
- PRINTED WIRING BOARD DESIGN
  - Lead-type SMDs
Links to relevant sites

LEGAL RSS Feeds