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CHAPTER 1 SOLDERING GENERAL
1.5 Materials for Mounting
1.5.5 Cleaning
| The conditions for flux cleaning and non-cleaning flux in NEC Electronics are as follows. |
| (1) Flux cleaning conditions |
| a) Cleaning solvent |
| 1. | Cleaning rosin based flux Ethyl alcohol, methyl alcohol, isopropyl alcohol, P3 cold cleaner, Pinealpha ST-100S, Bioact EC-7/EC-7R, Clean through -700 series |
|
| 2. | Cleaning soluble flux Purified water, city water |
| b) Cleaning method |
| 1. | Immersion cleaning, rinsing Solvent temperature: 40°C Time: 10 minutes or less |
|
| 2. | Ultrasonic cleaning Solvent temperature: 40°C Time: 5 minutes or less Frequency: 28 kHz or more Output: 15 W/liter or less |
|
(2) Non-cleaning flux |
| · Super low residual flux (Maker: TAMURA corporation ; Product No.: ULF-500VS, ULF-210R) · Low residual flux (Maker: TAMURA corporation ; Product No.: CF-220V) · Deactivated flux (AM-173) · Flux with chlorine content of 0.2 wt% or less |
| (3) Notes |
| · Semiconductor devices are not affected as long as they are cleaned with a solvent at a temperature of 70°C or lower. It should be noted, that some solvents do affect the device if their temperature rises Above 70°C. · After cleaning a device, touching the device should be avoided until it dries because the marking on the device may be erased. · When using ultrasonic cleaning, observe the following points. Semiconductor devices may be damaged if they come into direct contact with a resonator. If hollow package products (such as ceramic packages and canned cases) are cleaned by ultrasonic cleaning, the bonding wire may break. · Solder waste or impurities may cause degradation of insulation or characteristics. Perform evaluation by using an appropriate PWB to confirm that no problem occurs. |
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