Beginning of this page
Jump to main content

Please note that JavaScript and style sheet are used in this website,
Due to unadaptability of the style sheet with the browser used in your computer, pages may not look as original.
Even in such a case, however, the contents can be used safely.

Products > Packages > Semiconductor Device Mount Manual > SOLDERING GENERAL > Materials for Mounting >

CHAPTER 1 SOLDERING GENERAL


1.5 Materials for Mounting
1.5.4 Adhesive

In flow soldering, SMD packages are generally fixed to the printed wiring board temporarily using a bonding adhesive.

Consider the following factors when selecting a bonding adhesive.

  1. The bonding adhesive must have sufficient bonding strength.

  2. Use an appropriate amount of bonding adhesive: The standoff dimensions and weight of the parts must be taken into consideration so as to avoid insufficient bonding and unsoldered areas.

  3. Taking the reliability of the SMD into consideration, ensure that the hardening temperature is no higher than the glass transition point of a plastic package (about 150°C) and is within the prescribed storage temperature range of each product.






To 1.5.3 Solder pasteTo 1.5.5 Cleaning