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CHAPTER 1 SOLDERING GENERAL
1.5 Materials for Mounting
1.5.3 Solder paste
| Solder paste is made of evenly mixed solder powder, flux, and binder agent. The solder composition ratio must be selected according to the surface material of the pins of the SMD to be mounted. In particular if the surface material of the pins or conductive electrodes of the PWB is Ag, add several percentage of Ag to prevent leaching of the electrodes. Table 1-5-2 lists the major solder pastes and their features. The type of solder paste that is used has a significant influence on printability and solderability. Therefore, select the solder manufacturer, composition, particle size, flux content, and flux ingredients according to the soldering process. |
| Usage | Powder Type | Viscosity104cps | Particle Size/Mesh |
| Dispenser | Globular | 10 to 30 | 250 to 400 /325 to 400 |
| Screen | Globular | 40 to 60 | 250 to 400 /325 to 400 |
| Stencil (thickness < 1mm) |
Globular /Non-globular |
50 to 80 | 200 to 325 |
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