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CHAPTER 1 SOLDERING GENERAL
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1.4 Visual Check
1.4.2 Visual check of ball-type SMD
| The defects that can occur on packages such as BGAs and CSPs include defective solder, unsoldered connections, and shorting. However, because the solder connections are made on the bottom of the package, optical system equipment cannot detect unsoldered connection defects. Penetrative x-ray equipment can detect shorting defects, but not unsoldered connection defects. 3-D image detection methods are therefore used to check non-visible areas such as the underside of the package. These methods involve laminography, in which an x-ray scan beam is used, and tomosynthesis. |
| < 3-D Inspection Method > |
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| Figure 1-4-2. 3-D Inspection Method |
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