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CHAPTER 1 SOLDERING GENERAL
1.3 Rework
| (6) Solder joint reliability after rework |
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Table 1-3-1 lists temperature cycling test results of the reworked items described as examples.
Comparable connection reliability was obtained for reworked items and non-reworked items in this example.
Table 1-3-1. Temperature Cycling Test Results
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Rework
Yes/No
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Solder Paste
Supply Point
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Temperature Cycling Test Results (No. of Defective Devices/Input Devices)
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0 cycles
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500 cycles
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1000 cycles
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2000 cycles
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None (Ref.)
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—
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0/12
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0/12
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0/12
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0/12
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Yes
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On PWB pads
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0/12
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0/12
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0/12
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0/12
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Yes
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On BGA balls
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0/12
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0/12
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0/12
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0/12
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Package: 35 x 35 mm/352 pin PBGA (daisy chain)
Solder ball diameter: 0.75 mm (Sn-Pb eutectic solder)
Temperature cycle conditions: −40°C to 125°C
Failure definition: 20% nominal resistance increase.
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| Remark |
The rework method is introduced using examples in this chapter. Solder joint and device reliability after rework are not guaranteed. |
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