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Products > Packages > Semiconductor Device Mount Manual > SOLDERING GENERAL > Rework >

CHAPTER 1 SOLDERING GENERAL


1.3 Rework

(4) Remounting package (mounting and reflow)

 

When remounting the package, it is recommended to use rework equipment that allows aligning of the solder balls of the package and the pads of the printed wiring board for correct soldering.

Take the following into consideration during remounting.

  • As with removal, make sure to eliminate temperature variations in the temperature profile of BGA ball device.

  • Keep the package's surface temperature from exceeding the heat-resistance guaranteed temperature range.

(5) Visual check

 

Check with the same method as normal mounting. (See 1.4 Visual Check.)



To 1.3 (3) Supplying solder pasteTo 1.3 (6) Solder joint reliability after rework